| No. | Test Item | Test Conditions | Reference |
| 1 | High-Temperature Storage | Temperature: 125℃±3℃ Time: 1000±12 Hours |
MIL-STD-202 Method 108 |
| 2 | Temperature Cycle | Temperature 1: -55℃±3℃ Temperature 2: 125℃±3℃ Temperature change between T1 and T2 at the soonest Run 1000 cycles, maintain T1 and T2 5 minutes each in one cycle |
JESD22 Method JA-104 |
| 3 | Solder Heat Resistance | Pre-heat: 125℃ 60~120 Seconds Solder Temperature: 260℃±5℃ Time: 30 Seconds |
MIL-STD-202 Method 210 |
| 4 | Drop Test | 3 Times Free Fall from 150cm height to concrete floor | IEC 68-2-32 |
| 5 | High Temperature, High Humidity Storage | Temperature: 85℃±5℃ Relative Humidity: 80%--85% Time: 250Hours±12 Hours |
MIL-STD-202 Method 103 |
| 6 | Solderability | Dip in Flux：5~10 seconds Temperature: 245℃±5℃ Time: 10 Seconds |
J-STD-002 |
| 7 | Aging | Temperature: 85℃±2℃ Time: 250Hours±12 Hours |
MIL-STD-202 Method 103 |
| 8 | Thermal Shock | Temperature 1: -55℃±3℃ Temperature 2: 125℃±3℃ Temperature Change between T1 and T2: 5 Seconds 100 cycles, maintain T1 and T2 for 30 minutes each in one cycle |
MIL-STD-202 Method 107 |
| 9 | Vibration | Frequency Range: 10Hz~2000Hz Amplitude: 1.5mm or 20G 4 hours in each direction, a total of 12 hours |
MIL-STD-202 Method 204 |
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